At the maximum lead wire temperature of 260°C, the soldering time must not exceed 10s. This assumes that the solder joint is spaced not less than 5mm from the case. If the joint is spaced less than 5mm, the soldering time must be reduced to 3s.
Dip or Wave Soldering
Leaded devices: At the maximum soldering temperature of 260°C, the soldering time must not exceed 10s (or two times 5s at dual wave soldering). The soldering joint should be spaced not less than 1.5mm from the case.
SMD devices: The soldering time must not exceed 10s at 260°C when the device is submerged completely into the solder. At dual wave soldering, this corresponds to two times 5s.
Reflow Soldering
For reflow soldering of SMD devices the maximum admissible solder temperature is 260°C, for package outlines up to SMC/DO-214AB and peak time not exceeding 5s. Time above 255°C must not exceed 30s. For bigger case outlines, the solder temperature must be reduced.
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